Patents

Commitment to continued technical innovation and advanced substrate solutions.

REGAL® Flex process and material development has been and continues to be a pivotal focus of the Engineering and Research & Development departments. Our proven commitment to technological innovation ensures that today's leading edge developments become available as tomorrow's cutting edge production solutions. The following chronology of events shows patent awards and the gain of defense and commercial market acceptance.

1987	REGAL Flex developed; patent application 11/2/87
1988	Military version of VAX computer manufactured using REGAL flex
1989	US Patent 4,800,461 issued for multilayer rigid flex (REGAL 1)
1990	First commercial application for REGAL Flex (notebook computer)
	Compaq Computer licenses REGAL Flex
1991	Teledyne forms joint venture with Gul Technologies in Singapore. Relationship broadens REGAL Flex manufacturing base
1992	US Patent 5,095,628 issued for multilayer rigid flex (REGAL 5)
	US Patent 5,175,047 issued for multilayer rigid flex (REGAL 5 mod)
1995	Patent application for rigid/flex chip carrier
	REGAL Flex used in implantable medical device
1996	US Patent 5,505,321 issued for multilayer rigid flex (REGAL 1 mod)
1997	US Patent 5,591,519 issued for multilayer rigid flex (basestock)
	Patent applications for:
	- Rigid flex combined with soldermask - Rigid flex multilayer using angled prepreg
1998	US Patent 5,723,205 issued for multilayer rigid flex (REGAL 5 double-sided)
	US Patent 5,877,940 issued for multilayer rigid flex (REGAL 1 update)
1999	US Patent 5,997,983 issued for rigid flex printed circuit board using angled prepreg (REGAL X)